TPR of Copper Oxide Nanoparticles on Alumina – Understanding the Effects of Particle Size and Surface Chemistry

December 8, 2021

Overview

Temperature programmed reduction (TPR) is often used to characterize the reducibility of metal oxides. It is a fingerprint of the reduction of the material as a function of temperature. The peak areas and max peak temperatures gives information on the strength, heterogeneity, and quantity of the reducible species. TPR studies are often repeatable, but a change in the experimental conditions or preparation of the material can affect the results. Due to this complexity, experimental conditions are selected based on models such as Monti and Baiker – which considers the selection based on the heating rate, hydrogen concentration, total flow rate, and the amount of reducible material. In this webinar – we will explore this further using copper oxide on alumina support and present the effects of particle size, surface chemistry and how that effects the reduction fingerprint.
 

Speaker

Hoang Nguyen

Hoang Nguyen

Applications Scientist, Micromeritics Instrument Corporation

Hoang graduated from the University of California, Irvine with a B.S in Chemical Engineering in 2011. Prior to joining Micromeritics, he worked at Rosemount Analytical (Emerson) developing Automated On-line Analyzers for the measurement (PPB levels) of Silica, Phosphate, Sodium, and Hydrazine. In 2017, he returned to UCI to pursue graduate study in physical chemistry and worked on laser spectroscopy techniques such as Transient Adsorption Spectroscopy, Time Resolved Laser-induced Fluorescence, and Optical Tweezers. In 2019, he relocated to Georgia and joined Micromeritics as a lab analyst in the Particle Testing Authority Lab and in 2020 transitioned to the applications team at Micromeritics.

Available On Demand